Submit an Article

The Journal publishes scholarly works from leading academics and practicing attorneys, as well as student notes. We offer three methods to submit articles or notes: (1) Bepress’s ExpressO delivery service; (2) electronic submissions via e-mail; and (3) hardcopy submissions. Each method is detailed below, followed by further submission instructions.

  1. Bepress’s ExpressO service is available at the link below. Users will first need to register for a free ExpressO account. Once registered, users may submit their scholarly works to 750+ law reviews, including the Buffalo Intellectual Property Law Journal.
  2. Electronic submissions should be sent to:, Re: BIPLJ Article Submission
  3. Hardcopy submissions should be sent to the following address:
    University at Buffalo School of Law
    Buffalo Intellectual Property Law Journal
    404 John Lord O’Brian Hall, North Campus, Box 60110
    Buffalo, New York 14260-1100

Further Instructions:

Manuscripts should be typewritten and double-spaced, with one-inch margins and consecutively numbered pages. Footnotes should be numbered consecutively. In preparing text and footnotes, authors should consult the style presented in The Bluebook: A Uniform System of Citation (19th ed. 2010). Parallel citation to the United States Patents Quarterly (U.S.P.Q.) should be included where applicable.

For questions of literary style not included in The Bluebook, authors should consult The Chicago Manual of Style (16th ed. 2010). All citations should be placed in footnotes, even if the authority is mentioned in the text. The Editors reserve the right to make alterations and corrections regarding grammar, diction, spelling, syntax, matters of convention, and the substantive accuracy of the citations.

Manuscripts should be submitted to the Journal using Microsoft Word. Authors must also submit curriculum vitae in addition to the manuscript. If submitting via mail, please include a hard copy of the manuscript along with a disc copy.

For further information or questions concerning the submission process, please contact the Executive Submissions Editor at